Metadata

These top level fields identify the device and provide context for documentation generators.

Field	Required	Type	Description	Example
chip	Yes	String	The canonical part number or model name. Used for class naming.	TMP1075N
manufacturer	Yes	String	The name of the silicon vendor.	Texas Instruments
description	Recommended	String	A brief summary of the device's function.	Digital Temperature Sensor
interface	Yes	List[String]	Supported communication protocols.	[I2C, SMBus]
revision	No	String	If there are multiple silicon revisions that have different register maps.	A

Chip Notes

The chip name should not include the footprint portion of the device's part number. For example:

TMP1075DR - SOIC 8 package

TMP1075DSGR - WSON 9 package

Would both fall under the TMP1075.yaml file as there is no register difference. However,

TMP1075NDRLR - SOT-563 package

Would get its own TMP1075N.yaml as it has a slightly different register map than the TMP1075 no N. The register map difference is what requires the different file, not the packaging difference.

Package Suffixes

The package portion of part numbers should be left off, such as both the TMP1075DR and TMP1075DSGR parts drop their suffix to be combined into just TMP1075.yaml.

Interface Notes

The interface can be a variety of standard interface options such as:

• I2C
• SPI
• UART
• One Wire
• SMBus
• Quad SPI
• etc.

The interface name should be the widely used, condensed (I2C instead of Inter-Integrated Circuit) name for the bus. If a device has multiple communication protocols, all should be listed.

Revision Notes

The revision field should not be included unless silicon revisions affect the register map for simplicity.